Printed Circuit Board Assembly

  • In-house SMT process
  • Professional DFM (Design for manufacturability) expertise
  • Experienced customized SMT-process
  • Perform SMT inspection thru various tools
  • Chip-on-board (COB) process
  • Under fill, Conformal Coating process
  • In-house SMT process to support engineering pilot run, new process development and volume production
  • Professional DFM (Design for manufacturability) expertise to facilitate design optimization
    1. Apply Valor system for DFM review
    2. Perform SMT DOE (Design of Experiment) to ensure optimization of SMT parameters and process stability
  • Experienced customized SMT-process for special PCB fabrication
    1. Large dimension, high density PCB
    2. Capable to handle complicated devices, QFN (Quad Flat No-leads), BGA (Ball-Grid Array), PoP (Package on Packag), WLCSP (Wafer Level Chip Scale Package) 
  • Perform SMT inspection thru various tools in First Article SMT run to guarantee solderability
    1. X-ray, Cross Section on specific fine pitch components after SMT
    2. 3D SPI (Solder Paste Inspection), 3D AOI (Auto Optical Inspection) 
  • Chip-on-board (COB) process
  • Underfill, Conformal Coating process
 
mit-service-printed-circuit-board-assembly-smt1.jpg (252 KB) MTI_SMT_M3.jpg (49 KB)

 

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New Production Introduction (NPI)